摘要
基于环保与安全生产的需求,近年来无氰镀银技术成为电子电镀以及材料改性等领域的重要研究方向。本文综述了无氰镀银工艺中常用体系(主要包括硫代硫酸盐体系、丁二酰亚胺体系、烟酸体系、乙内酰脲体系、磺酸基体系等)的技术特点及存在的问题,介绍了无氰镀银技术在电力设备表面防护及印制电路板中表面处理等的实际应用情况,并对无氰镀银技术的研究现状和效果进行了总结和对比。
Based on the requirements of environmental protection and safe production,cyanide free silver plating technology is the key research directions of electronics plating and material modification,recently.The technical characteristics and existing problems of common systems in cyanide free silver plating process are summarized,mainly including thiosulfate system,succinimide system,nicotinic acid system,hydantoin system,sulfonic acid system and others.The practical application of cyanide free silver plating technology in surface protection of power equipment and surface treatment of printed circuit board is introduced.The research status and effect of cyanide free silver plating technology are summarized and compared.
作者
房成玲
何为
齐国栋
李超谋
王守绪
周国云
唐耀
苏新虹
叶依林
陈苑明
Fang Chengling;He Wei;Qi Guodong;Li Chaomou;Wang Shouxu;Zhou Guoyun;Tang Yao;Su Xinhong;Ye Yilin;Chen Yuanming(School of Materials and Energy,University of Electronic Science and Technology of China,Chengdu 611731,China;Zhuhai Founder Technology Gaomi Electronics Co.,Ltd.&Zhuhai Founder Technology Multilayer Circuit Board Co.,Ltd.,Zhuhai 519099,China;Zhuhai Jiesai Technology Co.,Ltd.,Zhuhai 519175,China)
出处
《电镀与精饰》
CAS
北大核心
2023年第8期59-66,共8页
Plating & Finishing
基金
国家自然科学基金项目(61974020)
珠海市创新团队项目(ZH0405190005PWC)。
关键词
无氰镀银
研究现状
应用
cyanide free silver plating
research status
application
