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基于环摆式双面抛光法加工预测模型的去除均匀性研究

Uniformity Removal Based on Processing Prediction Model of Ring-Pendulum Double-Sided Polishing Method
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摘要 针对环摆式双面抛光难以建立稳定去除函数并进行加工面型预测这一问题,提出了基于磨粒运动学的环摆式双面抛光加工预测模型,并通过预测模型分析不同参数影响下元件表面去除均匀性,针对不同特征面型给出优化策略以指导加工实验。首先,根据环摆式双面抛光机理,探究了环摆式双面抛光中影响去除均匀性的主要因素,提出了元件上、下表面磨粒运动学模型,结合Preston方程给出了基于磨粒运动学的环摆式双面抛光去除均匀性预测模型。根据实际加工工况,分析了不同抛光均匀性影响因素下的磨粒轨迹分布与抛光去除非均匀性,最后通过加工实验验证环摆式双面抛光加工预测模型。实验结果表明:环摆式双面抛光加工预测模型的预测结果与实际加工结果基本吻合,其面型去除特征相同。元件上表面是元件去除非均匀性的主要来源,通过改变中心偏心距、径向摆动距离等参数能改变元件上表面的去除非均匀性,从而影响元件整体面型特征,并实现基于预测模型指导下元件表面面型的快速收敛。 Objective With the further development of precision optical systems such as space telescopes and high-power solid-state laser devices,high-efficiency and batch processing requirements for medium-and large-aperture optical planar elements are put forward.For common deterministic polishing methods such as small tool polishing and ion beam polishing,which have high machining accuracy and positive removal effect,there are still some shortcomings such as low removal efficiency and long processing period,and thus they fail to meet the urgent needs of the market for precise optical components.The ring-pendulum double-sided polishing has been a promising method due to its high convergence rate,short processing cycle,and easy batch production.However,during the process of ring-pendulum double-sided polishing,it is difficult to establish a stable removal function to predict the surface profile due to the constant changes in the contact area between the polishing disc and the workpiece surface,which thus makes it impossible to provide sufficient guidance for the polishing process.In order to solve this problem,a prediction model for the uniformity removal of ring-pendulum double-sided polishing based on the kinematics of abrasive particles is proposed,and it can be used to analyze the element surface uniformity removal under the influence of different process parameters and provide the optimization strategy of process parameters,so as to improve the convergence efficiency and controllability of surface accuracy.Methods A prediction model for the uniformity removal of ring-pendulum double-sided polishing based on abrasive particle kinematics is built.Firstly,the main factors influencing the removal distribution in the ring-pendulum double-sided polishing are explored according to the polishing mechanism and removal law following the Preston equation.Then the kinematic models of abrasive particles on the upper and lower surfaces of a workpiece are established respectively,in view of the differences in polishing methods betwee
作者 王春阳 帅闻 肖博 黄思玲 王大森 Wang Chunyang;Shuai Wen;Xiao Bo;Huang Siling;Wang Dasen(Xi'an Key Laboratory of Active Photoelectric Imaging Detection Technology,Xi'an Technological University,Xi'an 710021,Shaanxi,China;School of Electronic and Information Engineering,Changchun University of Science and Technology,Changchun 130022,Jilin,China;School of Optoelectronic Engineering,Xi'an Technological University,Xi'an 710021,Shaanxi,China;Ningbo Branch of Chinese Academy of Ordnance Science,Ningbo 315103,Zhejiang,China)
出处 《光学学报》 EI CAS CSCD 北大核心 2023年第9期134-144,共11页 Acta Optica Sinica
基金 快速扶持项目(第二阶段)(80923010202)。
关键词 光学设计 环摆式 双面抛光 去除均匀性 加工预测 optical design ring pendulum double-sided polishing uniformity removal processing prediction
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