摘要
Electronic packaging materials and thermal interface materials(TIMs)are widely used in thermal management.In this study,the epoxy composites with core-shell structure SiC@SiO_(2) nanowires(SiC@SiO_(2) NWs)as fillers could effectively enhance the thermal conductivity of epoxy composites.The unique structure of fillers results in a high thermal conductivity of epoxy composites,which is attributed to good interfacial compatibility epoxy matrix and bridging connections of SiC@SiO_(2) NWs.From neat epoxy to 2.5 wt%loading of SiC@SiO_(2) NWs,the thermal conductivity is significantly increased from 0.218 to 0.391 W m^(−1) K^(−1),increased by 79.4%.In addition,the composite with 2.5 wt%filler possess lower coefficient of thermal expansion and better thermal stability than that of neat epoxy.All these outstanding properties imply that epoxy/SiC@SiO_(2) NWs composites could be the ideal candidate for TIM.
基金
The authors are grateful for the financial support by the National Natural Science Foundation of China(51573201 and 51303034)
Public Welfare Project of Zhejiang Province(2016C31026)
International S&T Cooperation Program of Ningbo(2015D10003)。
