摘要
采用氮化硅(Si3N4)和高密度聚乙烯(HDPE)粒子经粉末混合和热压成型制得导热复合材料。探究了SiN填料分散方式、粒径及用量等因素对复合材料性能的影响。实验表明,34SiN34粒子形成导热通路,随填料粒径下降,复合材料热导率升高,随填料用量增加,体系热导率显著增加,并保持很高的电绝缘性和一定的力学强度。
The thermally conductive composite was obtained from a particles mixture of silicon nitride（Si3N~） and high density polyellrylene （HDPE） by the powder-mixing and hot press molding. The effects of dispersion method, particle size and amount of the SizYa filler on the composite properties were explored. The experiments showed that the Si3N4 particles formed the thermal conduction path ways, the composite thermal conductivity was significantly increased with increasing the filler content and decreasing the particle size. And at the same time the high electrical insulation and certain mechanical strength was also maintained.
出处
《粘接》
CAS
2015年第5期37-42,共6页
Adhesion
