摘要
叙述国内外SMT相关标准和IPC几易其名,从印制电路技术领域跃升到电子电路装联与封装技术,再到更为高级的现代电子制造技术领域的创新。
This paper describes the SMT standards and IPC at home and abroad,from the printed circuit technology fi eld to electronic circuit assembly and packaging technology,and then to more advanced modern electronic manufacturing technology fi eld innovation.
作者
熊祥玉
闵慧华
XIONG Xiangyu;MIN Huihua
出处
《丝网印刷》
2023年第8期20-24,共5页
Screen Printing
