摘要
分别在不同焊接时间和不同焊接温度下制备了Sn35Bi0.3Ag/Cu焊接接头,采用扫描电子显微镜(SEM)、万能拉伸试验机、超声波成像无损探伤检测仪等测试手段,研究了焊接时间(1~9 min)和焊接温度(210~290℃)对Sn35Bi0.3Ag/Cu焊接接头微观结构和力学性能的影响.结果表明,在焊接过程中,Cu元素扩散到焊接界面处,形成了(Cu_(6)Sn_(5),Cu_(3)Sn)界面层,同时发现生成的Ag_(3)Sn相能够抑制界面层的生长.随着焊接时间的延长或焊接温度的升高,反应层变厚,抗剪强度先增大后减小.对焊接接头断口形貌分析发现,焊接接头的断裂由Bi相颗粒及Cu_(6)Sn_(5)颗粒共同作用.焊接接头的断裂发生在IMC/焊料一侧,Bi相颗粒及Cu_(6)Sn_(5)颗粒共同影响着接头的抗剪强度.此外,当焊接时间为3 min、焊接温度为230℃时,接头的钎着率最大,为99.14%,抗剪强度达到最大值,为51.8 MPa.
Sn35Bi0.3Ag/Cu welded joints were prepared at different welding time and temperature.The effects of weldingtime(1~9 min)and welding temperature(210~290℃)on the microstructure and mechanical properties ofSn35Bi0.3Ag/Cu welded joints were studyed by means ofscanning electron microscope(SEM),universal tensile testingmachine and ultrasonic scan machine.The results show thatthe Cu element diffuses into the welding interface and formsthe(Cu_(5)Sn_(6),Cu_(3)Sn)interface layer.The Ag_(3)Sn phase can inhibitthe growth of interfacial layer.With the increase of weldingtime or welding temperature,the reaction layer thickensand the shear strength increases first and then decreases.Theanalysis of the fracture morphology of the welded joint showsthat the fracture of the welded joint is jointly affected by Biphase particles and Cu_(6)Sn_(5)particles.The fracture of the weldedjoint occurs on the IMC/solder side.Bi phase particlesand Cu_(6)Sn_(5)particles affect the shear strength of the joint.In addition,when the welding time is 3 min and the welding temperatureis 230℃,the brazing rate is the highest(99.14%)and theshear strength reaches the maximum value(51.8 MPa).
作者
申兵伟
徐明玥
杨尚荣
刘国化
谢明
段云昭
SHEN Bingwei;XU Mingyue;YANG Shangrong;LIU Guohua;XIE Ming;DUAN Yunzhao(Kunming Insitute of Precious Metals,State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Sino-Platinum Metals Co.,Ltd.,Kunming 650106,China)
出处
《焊接学报》
EI
CAS
CSCD
北大核心
2023年第3期77-86,I0007,共11页
Transactions of The China Welding Institution
基金
国家自然科学基金资助项目(51961016)
国家科技部“科技助力经济2020”国家重点项目(202002AB080001-1)
云南省重大科技专项资助项目(202002AB080001-1-6,202002AB080001-1)
云南省科技人才与平台计划资助项目(202105AC160002,202105AE160027)。
