摘要
该文采用晶体相场方法研究金属微互连结构界面微裂纹在高低温情况下的扩展连通过程。研究表明:微裂纹在高温情况下,随着演化时间的增加,主裂纹逐渐长大,生长过程中伴随着二次微裂纹和三次微裂纹的生长,而在低温情况下,主裂纹随着演化时间的增加无明显变化,主裂纹几乎不扩展生长。随着演化时间的增加,微裂纹扩展速率逐渐减小。温度的改变并不影响原子间距和原子波动周期。
In this paper,the crystal phase field method is employed to study the growth and connection process of the interface microcracks in the metal microinterconnect structure at high and low temperatures.The results show that,with the increase of evolution time,the main crack gradually grows at high temperatures.Meanwhile,the appearance and growth of secondary microcracks and tertiary microcracks occurs during the growth process.At low temperatures,the main crack has no obvious change as the evolution prolongs.As the evolution time increases,the growth rate of microcrack gradually decreases.Different temperatures have no effect on atomic spacing and atomic fluctuation periods.
作者
马文婧
王进
吕美妮
宋宝林
马涛
陈慧
陈超
MA Wenjing;Wang Jin;Lv Meini;Song Baolin;Ma Tao;Chen Hui;Chen Chao(Guangxi Key Laboratory of Machine Vision and Intelligent Control,Wuzhou 543002;Wuzhou University,Wuzhou 543002,China)
出处
《有色金属设计》
2023年第1期125-128,共4页
Nonferrous Metals Design
基金
中央引导地方科技发展资金项目资助,广西科技基地和人才专项(项目编号:桂科AD20238053)
广西高校中青年教师科研基础能力提升项目(项目编号:2019KY0691和2020KY17010)
梧州学院重大项目(项目编号:2017A004和2017A005)。
关键词
微裂纹
晶体相场方法
金属微互连
扩展连通
Microcracks
Phase field crystal method
Micro-metal interconnection
Extended connection
