摘要
采用高能球磨机械合金化的方法制备Cu-25Ag合金,并进行100~700℃不同温度的退火,研究了其组织及性能随热处理温度的演变。结果表明,高能球磨使Ag过饱和固溶于Cu基体中,球料比为10∶1时,Cu的晶粒尺寸达到最小值4.73 nm,Ag在Cu中的固溶度显著提升至16.41%。热处理可使Cu-25Ag合金孔隙减小,固溶的Ag析出为富Ag相,其尺寸随温度的升高而粗化。随着热处理温度升高,合金硬度先升后降,电阻先大幅下降后趋于稳定。150℃时合金的硬度(HV)达到215.39,电阻率在450℃时达到最低值。
Cu-25Ag alloys fabricated by high-energy ball milling mechanical alloying were annealed at various temperatures in the range of 100~700 C,and the evolution of microstructure and performance with heat-treatment temperatures was investigated.The results indicate that Ag can be supersaturated and soluted in Cu matrix by high-energy ball milling.When the ratio of ball to material is lo:l,the grain size of Cu reaches the minimum of 4.73 nm and the solid solubility of Ag increase to 16.41%.Heat treatment can reduce the porosity of Cu-25Ag alloy,and Ag in solution is precipitated as Ag-rich phase,which is coarsened with annealled temperature increasing.With the increase of heat-treatment temperature,the hardness of alloy is firstly increased and then decreased monotonously,and the resistance is decreased sharply and then remain stable.The hardness of the alloy reaches the peak value of 215.39 HV at heat-treatment temperature of 150 C,and the resistivity reaches the minimun at 450℃.
作者
李欣
张林
张道琦
郭晓
王恩刚
Li Xin;Zhang Lin;Zhang Daoqi;Guo Xiao;Wang Engang(Key Laboratory of Electromagnetic Processes for Materials,Ministry of Education,Northeastern University;School of Metallurgy,Northeastern University)
出处
《特种铸造及有色合金》
CAS
北大核心
2023年第3期374-378,共5页
Special Casting & Nonferrous Alloys
基金
国家重点研发计划资助项目(2017YFE0107900)
国家自然科学基金资助项目(51674083)
国家111计划2.0资助项目(BP0719037)。
关键词
CU-AG合金
热处理温度
显微组织
力学性能
电学性能
Cu-Ag Alloy
Heat-treatment Temperature
Microstructure
Mechanical Properties
Electrical Properties
