摘要
Cu-C复合材料具有优越的导电、导热和力学性能,可用在电子封装、电子元件、热交换基板和散热器等领域。采用表面处理和机械合金化方法可以改善Cu-C的界面润湿性,增强界面结合力。通过无压烧结、热压烧结、等离子烧结和热挤压等成形工艺可以获得成分和组织均匀、性能良好的高致密度块体材料,为雷达高散热元器件的研制提供参考。
Due to improved mechanical properties, posites are promising functional materials used as enhanced conductivities and thermal stability, Cu-C com- electrical packing, electronic components, heat-spreading substrates and heat sinks. Surface chemical treatment and mechanical alloying methods are used to ameliorate the wettability and enhance the interfacial bonding strength between Cu and C. Bulk Cu-C composites with good constituent, microstructural homogeneity and full densification are acquired by pressureless sintering, hot-pressed sintering, spark plasma sintering, hot-extrusion and so on. It can provide a reference for the de- sign and application of highly heat-dissipating electronic components for the radar.
出处
《电子机械工程》
2014年第1期34-39,共6页
Electro-Mechanical Engineering
关键词
Cu—C复合材料
润湿性
雷达
高散热元器件
Cu-C composites
wettability
radar
highly heat-dissipating electronic components
