摘要
以聚丁二烯为树脂基体,玻纤布为增强材料,SiO_(2)为填料,采用浸渍及真空热压技术制备SiO_(2)填充碳氢树脂覆铜板,研究了SiO_(2)颗粒形貌(球形、角形)及粒径(2~20μm)对覆铜板介电性能、弯曲强度、剥离强度和吸水率的影响。结果表明:在相同粒径下,与角形SiO_(2)填充碳氢树脂覆铜板相比,球形SiO_(2)填充碳氢树脂覆铜板的介电常数、介电损耗和吸水率较低,弯曲强度和剥离强度较高,综合性能更优异;随着SiO_(2)粒径的增大,球形和角形SiO_(2)填充碳氢树脂覆铜板的介电常数、介电损耗、弯曲强度和吸水率均降低,剥离强度升高。
SiO_(2)filled hydrocarbon resin copper clad laminate was prepared by impregnation and vacuum hot pressing technology with polybutadiene as resin matrix,glass fiber cloth as reinforcement and SiO_(2)as filler,and the effects of SiO_(2)particle morphology(spherical shape and irregular shape)and particle size(2-20μm)on the dielectric properties,bending strength,peeling strength and water absorption of copper clad laminates were studied.The results show that with the same particle size,compared with the irregular SiO_(2)filled hydrocarbon resin copper clad laminate,the spherical SiO_(2)filled hydrocarbon resin copper clad laminate had relatively low dielectric constant,dielectric loss and water absorption,relatively high bending strength and peeling strength,and relatively good comprehensive performance.With increasing particle size of SiO_(2),the dielectric constant,dielectric loss,bending strength and water absorption of the spherical and irregular SiO_(2)filled hydrocarbon resin copper clad laminate decreased,while the peeling strength increased.
作者
张恩宁
金石磊
马峰岭
段家真
李小慧
ZHANG Enning;JIN Shilei;MA Fengling;DUAN Jiazhen;LI Xiaohui(Shanghai Key Laboratory of Engineering Materials Application and Evaluation,Shanghai Research Institute of Materials Co.,Ltd.,Shanghai 200437,China;School of Environmental and Materials Engineering,Shanghai Polytechnic University,Shanghai 201209,China)
出处
《机械工程材料》
CAS
CSCD
北大核心
2023年第1期65-69,共5页
Materials For Mechanical Engineering
关键词
SiO_(2)
碳氢树脂覆铜板
介电性能
剥离强度
吸水率
SiO_(2)
hydrocarbon resin copper clad laminate
dielectric property
peeling strength
water absorption
