摘要
针对高频通讯领域对聚酰亚胺(PI)薄膜材料的应用需求,以半脂环二胺5(6)-氨基-1-(4-氨基苯基)-1,3,3-三甲基茚满(DAPI)与不同的芳香二酐反应,合成了含半脂环结构的PI并制备了对应薄膜,探究了其结构与性能的相关性。结果表明:含半脂环结构的PI具有良好的可溶解加工性,能溶于NMP、DMF、CHC13等常规有机溶剂。制备的薄膜具有良好的力学性能和耐热性,拉伸强度为64.8~82.6 MPa,玻璃化转变温度最高可超过487℃。薄膜的介电常数(D_(k))为2.63~4.62(1 kHz~1 MHz)、2.46~2.75(10 GHz),介质损耗因数(D_(f))为0.003 1~0.020 5(1 kHz~1 MHz)、0.006 6~0.017 4(10 GHz)。其中,薄膜B-PI(BPADA-DAPI)在10 GHz下的介电常数为2.75,介质损耗因数为0.006 6,表明在PI分子主链上同时引入半脂环和双酚A结构能制备兼具高频低介电常数、低介质损耗的PI薄膜。
Aimed at the application requirements of polyimide(PI) film materials in the field of high frequency, polyimides containing semi-alicyclic structure were synthesized by the semi-alicyclic diamine 5(6)-amino-1-(4-aminophenyl)-1, 3, 3-trimethylindan(DAPI) with different aromatic dianhydrides. And their corresponding films were prepared, the correlation between their structure and properties was explored. The results show that polyimides containing semi-alicyclic structure have good solubility and processability, they are soluble in conventional organic solvents such as NMP, DMF, CHC13, etc.The corresponding films had good mechanical and thermal properties, their tensile strength ranges from 64.8 MPa to 82.6 MPa, and their glass transition temperature can exceed 487℃. The dielectric constant(D_(k)) of the PI films is 2.63-4.62 at 1 kHz-1 MHz and 2.46-2.75 at 10 GHz, respectively. The dissipation factor(D_(f)) is 0.003 1-0.020 5 at 1 kHz-1 MHz and 0.006 6-0.017 4 at 10 GHz, respectively. In particular, the Dkand Dfof the B-PI(BPADA-DAPI) film at 10 GHz is 2.75 and 0.006 6, respectively. It is indicated that the polyimide films with low dielectric constant and low dielectric loss at high frequency can be obtained by the introduction of semi-alicyclic moieties and bisphenol A groups into the main chains.
作者
陆健
邹国享
庄永兵
LU Jian;ZOU Guoxiang;ZHUANG Yongbing(School of Materials Science and Engineering,Changzhou University,Changzhou 213164,China;State Key Laboratory of Biochemical Engineering,Institute of Process Engineering,Chinese Academy of Sciences,Beijing 100190,China;School of Chemical Engineering,University of Chinese Academy of Sciences,Beijing 100049,China)
出处
《绝缘材料》
CAS
北大核心
2023年第2期39-45,共7页
Insulating Materials
基金
国家自然科学基金面上项目(52173210)。
关键词
聚酰亚胺
薄膜
高频
介电常数
介质损耗
polyimides
films
high frequency
dielectric constant
dielectric loss
