摘要
本文主要分析近年来国内外低介电常数聚酰亚胺树脂及薄膜的专利概况,介绍近年来学术研究中出现的聚酰亚胺低介电常数改性方法及在电子元器件的应用研究进展,并展望低介电常数聚酰亚胺未来的发展趋势。
The patent situation of low dielectric constant polyimide resin and film at home and abroad in recent years were analyzed in this paper,the modification methods of low dielectric constant polyimide in recent academic research and its application in electronic components were introduced,and the future development trend of low dielectric constant polyimide was pointed out.
作者
门秀婷
李铭新
MEN Xiuting;LI Mingxin(Pome Technology Co.,Ltd.,Liaocheng 252300,China)
出处
《绝缘材料》
CAS
北大核心
2022年第12期10-19,共10页
Insulating Materials
基金
山东省重大科技创新工程项目(2021CXGC010305)。
关键词
聚酰亚胺
低介电常数
低介质损耗
微电子
5G通讯
polyimide
low dielectric constant
low dielectric loss
microelectronics
5G communication
