摘要
简要介绍了二层柔性覆铜板的生产工艺、基体树脂配方及其性能特点,重点介绍了五类二层柔性覆铜板用的聚酰亚胺树脂即全芳香型、醚酮型、双酚(砜)A型、芳香酯型、混合型的聚酰亚胺树脂的研究进展,及其生产的二层柔性覆铜板的性能。
This paper Briefly introduces the producing processes, resin compositions, its characteristics of two-layer flexible copper clad lamination（FCCL） used in flexible printed circuit board （FPC）, and mainly introduces the advances and the performances of the polyimides which are used in two-layer FCCL and classified into five types of full-aromatic polyimide, ether-ketone polyimide, biphenol-（sulfone） polyimide, aromatic-ester polyimide and mixtures of aforesaid polyimide.
出处
《绝缘材料》
CAS
2006年第3期27-31,35,共6页
Insulating Materials
