摘要
正交误差是影响振动式硅微陀螺仪测量精度的主要因素之一,设计并制备了一种具有正交误差校正功能的高精度振动式微电子机械系统(MEMS)硅微陀螺仪。阐述了振动式硅微陀螺仪的工作原理,分析了正交误差产生的机理,并介绍了正交误差对陀螺仪测量精度的影响。为了进一步提升陀螺仪的测量精度,利用直流负刚度校正法对陀螺仪正交误差进行了校正,并通过有限元仿真确定了高精度陀螺仪敏感结构的最优参数。利用圆片级真空封装技术和绝缘体上硅(SOI)工艺实现了高精度陀螺仪敏感结构芯片的制备,采用高密度LCC20陶瓷管壳实现了高精度陀螺仪的集成封装。陀螺仪封装后,整体尺寸为9.0 mm×9.0 mm×2.8 mm。测试了陀螺仪的性能参数。测试结果表明,陀螺仪量程为±500°/s,零偏不稳定性为1.052°/h,零偏为0.004°/s,能够满足陀螺仪大部分中低精度应用需求。
Quadrature error is one of the main factors to affect the measuring precision of the vibratory silicon microgyroscope. A high-precision vibratory micro-electromechanical system(MEMS) silicon microgyroscope with quadrature error correction function was designed and prepared. The working principle of the vibratory silicon microgyroscope was described, the mechanism of the quadrature error was analyzed, and the influence of the quadrature error on the measuring precision of the gyroscope was introduced. Then, To improve the measuring precision of the gyroscope, the DC negative stiffness correction method was applied to correct the quadrature error of the gyroscope, and the optimal parameters of the sensitive structure of the high-precision gyroscope were confirmed through finite element simulation. The high-precision gyroscope sensitive structure chip was prepared by wafer level vacuum packaging technology and silicon-on-insulator(SOI) process. The integrated package of the gyroscope was realized with the LCC20 ceramic shell. The overall size of the gyroscope after packaging is 9.0 mm×9.0 mm×2.8 mm. The performance parameters of the gyroscope were measured. The test result shows that the range of the gyroscope is ±500°/s, the bias instability is 1.052°/h, the bias is 0.004°/s, which can meet the requirements of gyroscopes in most medium and low precision applications.
作者
董晓亮
张志勇
杨拥军
Dong Xiaoliang;Zhang Zhiyong;Yang Yongjun(The 13^(th)Research Institute,China Electronics Technology Corporation,Shijiazhang 050051,China)
出处
《微纳电子技术》
CAS
北大核心
2022年第8期795-800,830,共7页
Micronanoelectronic Technology
