摘要
介绍了表面抛光的工艺过程和技术原理,对影响抛光质量的关键部件抛光盘主轴和承载器进行分析研究。通过抛光压力精密控制,抛光结果满足晶片表面平坦化要求。
The process and technical principle of surface polishing are introduced,the key components those affect the polishing quality are analyzed and studied,such as the polishing disc spindle and carrier.By ways of polishing pressure precisely controlled,the polishing results meet the wafer surface planarization requirements.
作者
赵祥
张文斌
张世民
高岳
ZHAO Xiang;ZHANG Wenbin;ZHANG Shimin;GAO Yue(The 45^(th) Research Institute of CETC,Beijing 100176,China)
出处
《电子工业专用设备》
2022年第1期8-11,共4页
Equipment for Electronic Products Manufacturing
关键词
碲锌镉
表面抛光
承载器
Cadmium zinc telluride(CZT)
Surface polishing
Carrier
