摘要
随着射频领域小型化、多功能、高集成的需求增长,系统级封装成为射频组件新的发展方向。基于高温共烧陶瓷基板封装的SiP组件,结合装配工艺过程,研究植球、封装堆叠、表面贴装阶段的热冲击对各向同性环氧导电胶粘接强度的影响,对比了三种导电胶在多次热冲击下粘接强度的变化。试验结果表明,回流热冲击在一定程度上降低了导电胶的粘接强度,随着回流次数增加导电胶强度的降幅逐渐趋于稳定,经历10次回流后的导电胶强度仍然高于GJB 548B要求。
With the increasing requirements of miniaturization,multifunction and high integration in RF fields,the system in package technology has been a new development direction of RF modules.The effect of thermal shock for epoxy conductive adhesive during ball mounting,package stacking and surface mounting in HTCC RF SiP modules assembly process is researched.The shear strength of conductive adhesive is tested,and the difference of bonding strength between conductive adhesive with various components and performance after multiple reflow times is compared.The results show that the bonding strength of conductive adhesive is reduced by the reflow thermal shock,but the decrease is gradually stabilized with reflow times.The bonding strength of conductive adhesive still meets demands of GJB 548B after 10 times of reflowing.
作者
孙乎浩
王成
陈澄
韦炜
薛恒旭
SUN Huhao;WANG Cheng;CHEN Cheng;WEI Wei;XUE Hengxu(The 723rd Research Institute of CSSC,Yangzhou 225001,China)
出处
《电子工艺技术》
2022年第3期153-156,160,共5页
Electronics Process Technology
关键词
系统级封装
导电胶
热冲击
剪切强度
system in package
conductive adhesive
thermal shock
shear strength
