摘要
惯性器件、射频器件和光电器件等微机电系统(MEMS)已广泛应用于国防、医疗、生物科技行业。随着半导体器件封装技术的进步,MEMS器件也进一步朝低功耗、高集成度、高可靠性和高洁净度方向发展。晶圆键合是实现MEMS器件异质集成的关键工序之一。该工艺需将多个独立晶圆在真空环境下进行对准、键合,从而使上下晶圆内部形成一个封闭空腔,保证一定真空度。面向晶圆键合工艺需求,研究高真空环境下晶圆对准视觉成像及数据传输工作情况。结果表明:晶圆对准视觉成像系统在真空度为4.1×10^(-3) Pa环境下可正常工作;随着时间的推移,相机表面温度会快速上升;若在真空环境下,相机进行间歇式工作,则相机表面温度波动较小;USB2.0传输方式适用于真空环境;真空环境下相机可完成成像、数据传输。研究结果为真空环境下的视觉成像系统的设计提供了依据与参考。
Micro electromechanical systems(MEMS)such as inertial devices,RF devices and optoelectronic devices have been widely used in national defense,medical and biotechnology industries.With the progress of semiconductor device packaging technology,MEMS devices are further developing towards low power consumption,high integration,high reliability and high cleanliness.Wafer bonding is one of the key processes to realize heterogeneous integration of MEMS devices.In this process,multiple independent wafers need to be aligned and bonded in a vacuum environment,so that a closed cavity is formed in the upper and lower wafers to ensure a certain vacuum degree.Aiming at the requirements of wafer bonding process,the wafer alignment visual imaging and data transmission in high vacuum environment are studied.The results show that the wafer alignment vision imaging system can work normally under the vacuum of 4.1×10^(-3) Pa,and the camera surface temperature will rise rapidly with the passage of time,if the camera works intermittently in vacuum environment,the fluctuation of camera surface temperature is small,USB2.0 transmission mode is applicable to vacuum environment,the camera can complete imaging in vacuum environment.The research results provide a basis and reference for the design of visual imaging system in vacuum environment.
作者
武春晖
暴翔
王涛
张彦鹏
徐特
王成君
WU Chunhui;BAO Xiang;WANG Tao;ZHANG Yanpeng;XU Te;WANG Chengjun(The 2nd Research Institute of CETC,Taiyuan 030024,China;Jiangsu Weipu Photoelectric Technology Co.,Ltd.,Changzhou 213022,China)
出处
《电子工艺技术》
2022年第3期149-152,共4页
Electronics Process Technology
基金
科工局基础科研项目。
关键词
高真空视觉对准
数据传输
晶圆对准
晶圆键合
high vacuum visual alignment
data transmission
wafer alignment
wafer bonding
