摘要
提出了一种在模组底面同时设计弹性互连接口和芯片封装腔的集成架构,实现了芯片三维堆叠和电路面积的高效利用。重点介绍了三维模组的集成架构、弹性互连结构及装配工艺、宽带射频垂直互连的设计和研究。通过4~18 GHz三维射频前端模组的试制,验证了基于弹性互连三维集成架构的技术可行性,该射频前端模组具有高密度、高可靠、装配工序简单灵活的特点,可广泛应用于超宽带小型化射频系统。
An integrated architecture of arranging elastic interconnection interfaces and chip encapsulation cavity at the bottom of the module is proposed,which realizes the three-dimensional stacking of chips and the efficient utilization of circuit area.The design and research of the integrated architecture of three-dimensional modules,elastic interconnection structure and assembly process,broadband radio frequency vertical interconnection are mainly introduced.Through the trial production of 4~18 GHz 3D RF front-end module,the technical feasibility of 3D integrated architecture based on elastic interconnection is verified.The RF front-end module has the characteristics of high density,high reliability,simple and flexible assembly process,and can be widely used in ultra-wide band miniaturization RF systems.
作者
卢子焱
张继帆
董东
韩思扬
彭文超
LU Ziyan;ZHANG Jifan;DONG Dong;HAN Siyang;PENG Wenchao(The 29th Research Institute of CETC,Chengdu 610036,China;Sichuan Province Engineering Research Center for Broadband Microwave Circuit High Density Integration,Chengdu 610036,China)
出处
《电子工艺技术》
2022年第3期135-138,共4页
Electronics Process Technology
