摘要
多功能芯片由单入单出单通道升级为多入多出多通道收发芯片,并大量应用于现代通信领域。针对多收发通道多功能芯片测试过程中,多次移动探针、重复压针、无法自动测量、测试效率低等不足,研究了多端口在片校准技术。通过去嵌入校准方法,将校准面移到探针尖端,实现了多端口微波探针在片精确校准。提出了一次压针测试多端口芯片各项参数的方法,利用定制的集成多端口共面探针,搭建了一次压针全通道测试系统,通过软件控制开关矩阵,完成多端口信号传输及数据采集,实现一次压针全通道测试。并与传统测试方法的测试数据进行对比分析,证明了该方法的可行性。
Multi-function chips have been upgraded from single-input single-output and single-channel to multi-input multi-output and multi-channel transceiver chips, and are widely used in the field of modern communications.Aiming at the disadvantages of repeatedly moving the probe, repeatedly pressing probe, unable to automatically measure, low testing efficiency and so on, during the test process of multi-function chips with multi-transceiver ports, the multi-port on-chip calibration technology was studied.Through the de-embedding calibration method, the calibration surface was moved to the probe tip to realize the on-chip accurate calibration of multi-port microwave probe.A method for testing various parameters of multi-port chips with one-time pressing probe was proposed.With the customized integrated multi-port coplanar probe, the full-channel test system for one-time pressing probe was built.The switch matrix was controlled by software to complete multi-port signal transmission and data acquisition, and realized the full-channel test of one-time pressing probe.Compared with the test data of conventional test methods, the feasibility of the proposed method was proved.
作者
陈兴
樊渝
李梦琪
Chen Xing;Fan Yu;Li Mengqi(The 13^(th)Research Institute,CETC,Shijiazhuang 050051,China)
出处
《半导体技术》
CAS
北大核心
2022年第4期332-335,共4页
Semiconductor Technology
关键词
多功能芯片
多通道
共面探针
去嵌入
S参数
multi-function chip
multi-channel
coplanar probe
de-embedding
S parameter
