摘要
针对导电银胶应用于压电材料时,存在固化温度高、固化时间长、剪切强度弱的问题,通过有机溶液对导电填料预处理,选用性能稳定、毒性小、无挥发性的双氰胺作为固化剂,制备出具备高剪切强度和优良电性能的低温固化导电银胶。实验结果表明:选用双氰胺作为固化剂,由Nano-Ag、Cu、ZnO混合而成的导电填料,经环己酮和乙醇混合液处理,配制的导电银胶对人体无刺激,微观结构更致密,固化温度为100℃,固化时间为30 min,体积电阻率和剪切强度可达到0.421×10^(-4)Ω·cm和14.03 MPa。
For the problems of high curing temperature,long curing time,and weak shear strength when the conductive silver glue is applied to piezoelectric materials,the low-temperature curing conductive silver glue with high shear strength and excellent electric properties was prepared through the organic solution pretreatment of the conductive fillers,and selection of stable-performance,low-toxicity,no-volatile dicyandiamide as the curing agent.The experimental results show that the conductive silver gel with the conductive filler made of nano-ag,Cu and ZnO,which is obtained by using dicyandiamide as a uring agent and treated by the mixture of cyclohexanone and ethanol,has no stimulation to the human body,the microstructure is more compact,the curing temperature is 100℃,the curing time is 30 min,and the bulk resistivity and shear strength can reach 0.421×10^(-4)Ω·m and 14.03 MPa.
作者
张静欣
廖擎玮
王丽坤
ZHANG Jingxin;LIAO Qingwei;WANG Likun(Key Laboratory of Sensors,Beijing Information Science&Technology University,Beijing 100101,China)
出处
《北京信息科技大学学报（自然科学版）》
2022年第1期45-49,共5页
Journal of Beijing Information Science and Technology University
基金
国家自然科学基金资助项目(61871043)。
关键词
表面导电处理
粘合剂
预处理
纳米银粉
surface conductive treatment
adhesive
pretreatment
nano silver powder
