摘要
以聚酰胺6(PA6)、聚碳酸酯(PC)及其复合材料为基材,通过熔融挤出法制备了一系列激光直接成型(LDS)合金材料,研究了其热性能、耐溶剂性、力学性能及断裂机理,并验证了其用于手机结构件制造时的可靠性和安全性。结果表明,LDS合金材料具有特殊的热性能和流变行为,PA6组分有利于提高合金的耐溶剂性,PC组分有利于提高材料的耐热性;随着PA6含量的增加,LDS合金的缺口冲击强度、断裂伸长率、拉伸强度和模量、弯曲强度和模量均先减小后增大;纯PC基合金材料的断裂形式为韧性断裂,断裂机理为材料受外力作用形成剪切带和网络结构化,纯PA6基及PA6/PC基LDS合金材料的断裂形式为脆性断裂,以两相分散形成"海-岛"结构、剪切破坏引发产生银纹以及产生空穴化效应为主要断裂机理;LDS合金具有优良的激光活化与化学镀功能,铜镍金属镀层可靠性、安全性高,可用于立体结构器件电路制造。
A series of laser direct structuring(LDS)alloys based on polyamide 6(PA6),polycarbonate(PC)and their composite materials were prepared using a melt extrusion method.The thermal properties,solvent resistance,and mechanical properties of the LDS alloys were characterized,and their fracture mechanism was investigated.The reliability and safety of the resultant materials used for the manufacture of mobile phone components was also verified.The results indicated that the LDS alloys had special thermal properties and rheological behaviors.The PA6 component improved the solvent resistance of the alloys,while the PC component increased the heat resistance of the alloys.With an increase in the PA6 content,the notched impact strength,elongation at break,tensile strength and modulus,flexural strength and modulus of the LDS alloy all decreased at first and then increased.The LDS alloy with pure PC showed a ductile fracture,whose fracture mechanism was attributed to the formation of shear bands resulting from the external force and network structures.The LDS alloys with pure PA6 and PC/PA6 exhibited a brittle fracture,and their corresponding fracture mechanism was ascribed to the formation of a“sea-island”structure based on two phases,crazing caused by shearing fracture,and cavitation effect.The LDS alloys had excellent laser activation and electroless plating functions,and the copper/nickel plating layer displayed high reliability and safety.The alloys developed in this study were suitable for manufacturing the circuits of devices with a heterostructure.
作者
于志省
李应成
王洪学
庞馨蕾
王宇遥
YU Zhixing;LI Yingcheng;WANG Hongxue;PANG Xinlei;WANG Yuyao(R&D Division for Synthetic Polymers,Sinopec Shanghai Research Institute of Petrochemical Technology,Shanghai 201208,China)
出处
《中国塑料》
CAS
CSCD
北大核心
2022年第2期8-12,共5页
China Plastics
基金
中国石油化工股份有限公司资助项目(218024-9)。
关键词
激光直接成型
聚酰胺6
聚碳酸酯
断裂机理
立体电路
laser direct structuring
polyamide 6
polycarbonate
fracture mechanism
heterostructure circuit
