摘要
因传统均温冷板采用定制化设计,导致“三化”水平低,种类繁多,生产成本高等问题。针对上述问题,本文提出了一种基于嵌入式结构的电子设备冷板设计方法,设计了一种低热阻铜铝焊接工艺,形成了标准化、系列化、模块化的电子设备高效散热冷板,缩短了生产周期,降低了生产成本,实现了均温板技术在电子设备散热领域中的广泛应用。
Due to the custom design of the traditional uniform temperature cooling plate,the"three modernization"level is low,various,and the production cost is high.According to the above problem,this paper puts forward a kind of electronic equipment based on embedded structure design method of cold plate,design a kind of low thermal resistance of copper aluminum soldering process,formed the standardization,seriation,modularization of electronic equipment and efficient cooling pipes,shorten the production cycle,reduce the production cost,realize the mean temperature plate technology is widely used in the field of electronic equipment heat dissipation.
作者
王永峰
罗先培
WANG Yong-Feng;LUO Xian-Pei(Lianyungang Junze Electromechanical Technology Co.,Ltd.,Lianyungang Jiangsu 222006,China;Shanghai Marine Electronic Equipment Research Institute,Shanghai 201108,China)
出处
《机电产品开发与创新》
2021年第6期22-24,共3页
Development & Innovation of Machinery & Electrical Products
关键词
“三化”设计
嵌入式
高导热
冷板
回流焊
"three modernization"design
Embedded
High thermal conductivity
Cold plate
Reflow welding
