摘要
针对在电子器件上镀覆纯镍无法满足高硬度、高强度以及强耐磨性需求的现状,采用电沉积的方式制备了纳米金刚石增强镍基的复合镀层。利用扫描电子显微镜(SEM)对制备的复合镀层的表面形貌进行表征,并对其进行了维氏硬度(HV)测试。结果表明,嵌入粒径100 nm金刚石颗粒的镀层,HV由镍单层膜的236提升至403,提高了约70.76%。对比嵌入粒径为500 nm的镀层样品,硬度提高了约59.29%,验证了镀覆粒径为100 nm金刚石颗粒的复合电镀膜可有效提高镀层的硬度。最后,将镍/金刚石复合镀层的制备技术与LIGA工艺体系整合,研制了镍/金刚石基弹簧型的微结构。
For current situation that pure nickel plating on electronic devices cannot meet the requirements of high hardness,high strength and strong wear resistance,the nano-diamond-reinforced nickel-based composite coatings were prepared by the electrodeposition method.The surface morphology of the prepared composite coatings were characterized by the scanning electron microscope(SEM),and the Vickers hardness(HV)test was carried out.The results show that the HV of the coatings embedded with 100 nm diamond particles is increased from 236 of the nickel single-layer film to 403,i.e.an increase of about 70.76%.Compared with the coating sample with an embedded particle size of 500 nm,the hardness is increased by about 59.29%,verifying the effective improvement of the hardness of the coatings with the composite electroplating film of diamond particles with a plating particle size of 100 nm.Finally,the preparation technology of the nickel/diamond composite coatings were integrated with the LIGA process system to develop a nickel/diamond-based spring-type microstructure.
作者
范若欣
赖丽燕
李以贵
Fan Ruoxin;Lai Liyan;Li Yigui(School of Science,Shanghai Institute of Technology,Shanghai 201418,China)
出处
《微纳电子技术》
CAS
北大核心
2021年第11期965-970,共6页
Micronanoelectronic Technology
基金
国家自然科学基金青年基金资助项目(6210032321)
上海市科技兴农重点攻关项目(沪农科创字(2018)第3-3号)
上海市“联盟计划”资助项目(LM201929)
2021年大学生创新创业培训项目(DCX20210105)。
