摘要
5G通信的快速发展对低介电常数高导热系数的介质材料提出了明确要求。通过溶胶-凝胶法,将球状二氧化硅(SiO_(2))紧密包覆在片状石墨烯(GNP)上,得到SiO_(2)@GNP (SG)复合材料,再将其填充至低密度聚乙烯基体(LDPE)中,制得SG/LDPE (SGL)复合材料。研究表明,相比于纯LDPE,当填料含量为1%时, SGL复合材料的介电常数相比纯LDPE降低了13.3%(10 Hz),介电损耗低于0.021 (10~106Hz),导热系数达到了0.555 W/(m·K),较纯LDPE相比提升了15%,显示出良好的电绝缘性和导热性。这类具有低介电常数、低介电损耗和高导热系数的复合材料,能够扩大应用场景,提高使用寿命,为5G通信领域的广泛应用提供一个可行的方向。
With the rapid development of 5G communication, there are definite requirements for dielectric materials with low dielectric constant and high thermal conductivity. The spherical silica was tightly coated on flake graphene(GNP) and prepared SiO_(2)@GNP(SG)composites by sol-gel method, and then filled into the low density polyethylene(LDPE) matrix to prepare SG/LDPE(SGL) composites.Compared with pure LDPE, the dielectric constant of SGL composite with 1% filled content decreased by 13.3%, the dielectric loss is always lower than 0.021(10~106 Hz), and the thermal conductivity reaches 0.555 w/(m·K), which is increased by 15% of pure LDPE,showing good electrical insulation and thermal conductivity. This kind of composites with low dielectric constant, low dielectric loss and high thermal conductivity can expand the application scenario and improve the service life, providing a feasible direction for the wide application in the field of 5 G communication.
作者
杨晨
杨丹丹
YANG Chen;YANG Dandan(School of Energy and Materials,Shanghai Polytechnic University,Shanghai 201209,China)
出处
《上海第二工业大学学报》
2021年第3期184-188,共5页
Journal of Shanghai Polytechnic University
基金
上海第二工业大学大学生创新项目(202112044102)资助。
关键词
低介电常数
高导热系数
二氧化硅
石墨烯
低密度聚乙烯
low dielectric constant
high thermal conductivity
silicon dioxide
graphene
low density polyethylene
