摘要
集成电路作为整机装备的重要组成部分,其可靠性是一项非常重要的指标。运用实际的失效案例,采用SEM、EDS、显微红外光谱分析、热重分析和TOF-SIMS等失效分析方法,在分析集成电路失效现象与定位故障原因的基础上,研究环境中沾污对集成电路原材料外壳可靠性的影响,并提出了外壳贮存的保障措施,对于提升原材料的使用可靠性具有重要的意义。
As an important part of the complete machine equipment,the reliability of integrated circuits is a very important indicator.On the basis of actual failure cases,the failure analysis methods of SEM,EDS,micro-infrared spectroscopy,thermogravimetric analysis and TOF-SIMS are used.And based on the analysis of integrated circuit failure phenomena and locating the cause of the failure,the influence of contamination in the environment on the reliability of integrated circuit raw materials shells is studied,and the safeguard measures for shell storage are proposed,which are of great significance for improving the reliability of raw materials.
作者
张宏飞
李丹
ZHANG Hongfei;LI Dan(Aviation Representative Office of the Army Equipment Departement in Luoyang,Luoyang 471009,China;The 24th Research Institute of CETC,Chongqing 400060,China)
出处
《电子产品可靠性与环境试验》
2021年第4期30-33,共4页
Electronic Product Reliability and Environmental Testing
关键词
沾污
外壳
贮存
可靠性
失效分析
保障措施
contamination
shell
storage
reliability
failure analysis
safeguard measure
