摘要
光模块主要的作用完成光电信号的转化和电光信号的转换。光模块印制板表面有高速传输信号线、芯片焊接绑定线盘和高精度长短印制插头等设计,因此这对印制板的表面加工提出很高要求,文章通过对光模块印制板影响表观品质的树脂塞孔工艺和减少异物的研究以提升量产良率,对量产光模块板的技术人员提供一定的借鉴作用。
The main function of optical module is to complete the conversion of photoelectric signal and electro-optic signal.The surface of optical module PCB is designed with high-speed transmission signal line,chip welding bonding line and Pad,high-precision long and short gold fingers.Therefore,it puts forward high requirements for the surface processing of PCB.In order to improve the yield of mass production,this paper studies the resin plug hole process and the reduction of foreign matters that affect the apparent quality of optical module PCB and provides a certain reference for the technical personnel of mass production of optical module PCB.
作者
张大伟
吕小伟
Zhang Dawei;Lv Xiaowei
出处
《印制电路信息》
2021年第7期40-45,共6页
Printed Circuit Information
关键词
光模块
表面处理
下凹
Optical Module
Surface Treatment
Dimple
