摘要
提出采用自隔离散热技术解决大功率倒装单片集成LED芯片散热与绝缘之间的矛盾问题。基于自隔离散热技术原理,利用微纳加工技术,通过在AlN陶瓷基板上生长隔离金属岛制备自隔离散热基板。采用多胞串并联网络结构设计大功率倒装单片集成LED芯片,芯片尺寸为1.5 mm×4.5 mm。在200 mA的驱动电流下,大功率倒装单片集成LED芯片的正向电压为8.3 V,反向漏电流小于100 nA。当输入电流为2 A时,大功率倒装单片集成LED芯片的输入功率为20 W,其最大光输出功率为8.3 W,插墙效率为42.08%,峰值热阻约为1.23 K/W,平均热阻约为1.17 K/W。
The self-isolation heat dissipation technology was proposed to solve the contradiction between heat dissipation and insulation of high power flip-chip monolithically integrated LED chip.Based on the principle of self-isolation heat dissipation technology,the self-isolation heat dissipation substrate was prepared by growing isolated metal islands on the AlN ceramic substrate using micro-nano fabrication technology.The high power flip-chip monolithically integrated LED chips were designed using multi-cell series and parallel structures,and the chip size was 1.5 mm×4.5 mm.At the driving current of 200 mA,the forward voltage of the high power flip-chip monolithically integrated LED chip is 8.3 V,and the reverse leakage current is less than 100 nA.When the input current is 2 A,the input power of the high power flip-chip monolithically integrated LED chip is 20 W,and the maximum optical output power of the chip is 8.3 W,the wall-plug efficiency can reach 42.08%,the maximum thermal resistance is about 1.23 K/W and the average thermal resistance is about 1.17 K/W.
作者
吴林枫
唐文婷
陈宝
易翰翔
李玉珠
王保兴
蔡勇
Wu Linfeng;Tang Wenting;Chen Baojin;Yi Hanxiang;Li Yuzhu;Wang Baoxing;Cai Yong(School of Electronics and Information Engineering,Hangzhou Dianzi University,Hangzhou 310018,China;Suzhou Institute of Nano-Tech and Nano-Bionics,Chinese Academy of Sciences,Suzhou 215123,China;Ningbo Sky Torch OptoelectricTechnology Co.,Ltd.,Ningbo 315300,China;Guangdong Deli Optoelectronics Co.,Ltd.,Jiangmen 529020,China)
出处
《半导体技术》
CAS
北大核心
2021年第7期565-571,共7页
Semiconductor Technology
关键词
自隔离散热技术
大功率倒装单片集成LED
光输出功率
插墙效率
热阻
self-isolation heat dissipation technology
high power flip-chip monolithically integrated LED
light output power
wall-plug efficiency
thermal resistance
