摘要
随着通信技术不断向着高频波段发展,以酚醛树脂和环氧树脂为基材的印制电路板(PCB)因其介电性能无法满足信号高速、低损耗传输而面临淘汰。因此,开发高频下具有低介电常数和低介电损耗,同时又具有良好耐热性、耐湿性和尺寸稳定的高分子材料用于制造高频PCB,对高频通信技术至关重要。其中聚苯并噁嗪、聚氰酸酯、聚四氟乙烯、聚酰亚胺和聚苯醚等高分子材料因本征介电常数和介电损耗较低、吸湿率小、耐热性好,在高频PCB领域受到广泛关注。针对近年国内外高频PCB用的低介电高分子材料的研究现状,从材料介电性质基本原理出发,综述了高频PCB用的低介电高分子材料的性质及其改性的研究进展。
With the development of high-frequency communication technology,the demand for polymer materials used in high-frequency printed-circuit board(PCB)is increasing,such as low dielectric loss for reduced signal loss as it passes along a transmission line on a dielectric material,low moisture absorption and low dielectric constants for higher signal propagation speeds,high glass transition temperature for plated through hole reliability and high heat resistance for short term resistance of products to solder processing.However,the performance of traditional printed circuit board based on phenolic resin and epoxy resin cannot meet the requirements of the high-frequency communication technology.Consequently,developing the new materials with low dielectric constant,low dielectric loss,heat resistance,low moisture absorption and excellent dimensional stability is significant to high-frequency signal transmission.Polybenzoxazine,cyanate ester,polytetrafluoroethylene,polyimide and polyphenylene oxide have attracted much attention for relatively lower intrinsic dielectric constant and dielectric loss,enormous research has been done.In order to further reduce dielectric constant and dielectric loss,and improve comprehensive performance of polymers,recently,enormous research has been done.For instance,to reduce dielectric constant and dielectric loss,extensive work has been directed to design molecular structure,which includes the incorporation of low polarizability groups,space-occupying groups and fluorinated monomers,and some works focused on adding nano porous materials,such as polyhedral oligomeric silsesquioxane,mesoporous silica and hollow silicon tube,or introducing pore structure in polymers.To improve thermal stability or mechanical property,some research concentrated on blending two or more polymers together,and special performance materials are obtained by playing the advantage of each component polymers.In this review,the up-to-date research progresses in the field of low dielectric polymers for high frequency PCB
作者
廖凌元
彭忠泉
章明秋
阮文红
LIAO Lingyuan;PENG Zhongquan;ZHANG Mingqiu;RUAN Wenhong(Key Laboratory for Polymeric Composite and Functional Materials of Ministry of Education,Guangdong Provincial Key Laboratory of High-performance Resin-based Composites,School of Chemistry,Sun Yat-sen University,Guangzhou 510275,China;Kingfa Sci&Tech Co Ltd,Guangzhou 510700,China)
出处
《功能高分子学报》
CAS
CSCD
北大核心
2021年第4期320-335,共16页
Journal of Functional Polymers
基金
国家自然科学基金重点项目(52033011)
广东省重点领域研发计划项目(2019B010929001)
广州市科技计划项目(201902010050、202007020001)。
关键词
高频
低介电常数
低介电损耗
高分子材料
印制电路板
high frequency
low dielectric constant
low dielectric loss
polymer material
printed circuit board
