摘要
以含磷环氧树脂(ED)为基体,含氮酚醛固化剂(MFP),2-甲基咪唑为固化促进剂组成ED/MFP固化体系。结合非等温(动态)DSC法和红外跟踪,借助T-β图外推法,确定ED/MFP固化体系最佳固化工艺为:125℃/1 h+145℃/2 h+160℃/3 h+180℃/2.5 h,240℃下后处理3 h。采用Kissinger法计算出体系的表观活化能为59.14 kJ/mol,结合Crane公式理论计算出该体系的反应级数为0.89。
A phosphorated epoxy resin/nitrogen-containing phenolic aldehyde curing agent（ED/MFP） system,which uses ED as matrix,MFP as curing agent and 2-methylimidazole as curing accelerator was investigated.The corresponding curing parameters of ED/MFP determined by dynamic DSCmethod,infrared tracking experiments and extrapolation of T-β figure are as follows： the mixtures are cured in a vacuum oven for 1h at 125 ℃,2 h at 145 ℃, 3 h at 160 ℃ and 2.5 h at 180 ℃,followed by post-curing in vacuum oven at 240 ℃ for 3 h.The apparent activation energy of ED/MFP obtained from Kissinger method is 59.14 kJ/mol.Based on Crane formula,the calculated reaction order is 0.89;and the kinetic equation for the curing reaction is：-dα/dt=k（1-α）^0.89 .
出处
《绝缘材料》
CAS
北大核心
2010年第1期58-61,共4页
Insulating Materials
关键词
含磷环氧树脂
含氮酚醛固化剂
非等温DSC
红外跟踪
phosphorated epoxy resin
nitrogen-containing phenolic aldehyde curing agent
dynamic DSC
infrared tracking
