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基于真实组织的模拟技术在热障涂层热导率预测中的应用探索 被引量:3

Application Exploration on the Thermal Conductivity Prediction of Thermal Barrier Coating by the Modeling Technique Based on Real Coating Structure
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摘要 孔隙结构是影响涂层热导率的关键因素,采用激光脉冲法对2种工艺参数制备的YSZ热障涂层的热导率进行测试,并利用面向对象有限元分析技术(OOF)研究热障涂层微观结构对热导率的影响,探讨该技术在热障涂层隔热性能研究中应用的可行性和影响因素。结果表明:基于真实涂层组织结构的热导率预测计算结果会受到模拟过程中的边界条件、网格划分方法的影响,通过边界条件的优化,可以获得与真实热导率接近的结果;采用第三类网格进行计算,且采用自由换热传热模型获得的计算热导率更接近于实测值。在工程实践中基于涂层应用工况和性能需求,可采用基于真实组织结构的模拟技术进行涂层材料和工艺的优化。 Pore structure is one of key factors affecting the thermal conductivity of coating.The thermal conductivity of YSZ thermal barrier coatings prepared with two different parameters were tested by laser flash method,and the influence of the thermal barrier coating microstructure on the thermal conductivity was discussed based on object-oriented finite element analysis(OOF).In addition,the feasibility and influencing factors of this technology for studying thermal insulation performance of thermal barrier coatings are discussed.Results showed that the calculated thermal conductivity based on the real coating microstructure would be affected by the boundary conditions and grid methods during simulation process.Through the optimization of the boundary conditions,the calculated thermal conductivity close to the true value could be obtained.Compared with other boundary conditions with using the third type of grid method and free heat transfer model,the calculated thermal conductivity was closer to the measured results.In practical engineering,according to the coating application conditions and performance requirements,the developed simulation techniques based on real microstructures of coatings could be employed to optimize coating materials and processes.
作者 李勇 高禄平 刘福广 刘刚 李青 LI Yong;GAO Lu-ping;LIU Fu-guang;LIU Gang;LI Qing(Xi’an Thermal Power Research Institute Co.,Ltd.,Xi’an 710032,China;Fujian Ningde Nuclear Power Co.,Ltd.,Fuding 355200,China)
出处 《材料保护》 CAS CSCD 2021年第3期9-14,22,共7页 Materials Protection
关键词 热障涂层 热导率 微观结构 OOF分析 thermal barrier coatings thermal conductivity microstructures object-oriented finite element analysis
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