摘要
聚酰亚胺(PI)作为一种特种工程塑料而被广泛应用,但由于PI的熔融性能较差,产业化发展受到了限制。通过对热固性PI进行改性开发出的热塑性聚酰亚胺(TPI),其熔融性能和加工性能相对热固性PI有了质的提升,能够应用于柔性覆铜板、3D打印等领域。本文概述了TPI的合成方法及热学、力学、加工性能,总结了TPI在柔性线路板及其他重要工业领域的应用,提出了TPI未来的研究方向。
Polyimide(PI)has been widely used as a kind of special engineering plastic.However,the further industrialization development of PI is limited due to its poor melting property.Thermoplastic polyimide(TPI)is developed by modifying the thermosetting PI,and its melting property and processability are improved qualitatively compared to thermosetting PI,so that it can be applied to flexible copper clad laminate,3D printing and other fields.In this paper,the synthetic method,thermal,mechanical,and processing properties of TPI were summarized,and the application of TPI in flexible printed circuit and other important industrial fields were concluded.The future research directions of TPI were proposed.
作者
刘存生
陈钰玮
曹景茹
刘佳
马小华
刘屹东
闵永刚
LIU Cunsheng;CHEN Yuwei;CAO Jingru;LIU Jia;MA Xiaohua;LIU Yidong;MIN Yonggang(School of Materials and Energy,Guangdong University of Technology,Guangzhou 510006,China;Dongguan South China Design Innovation Institute,Dongguan 523808,China)
出处
《绝缘材料》
CAS
北大核心
2021年第4期1-7,共7页
Insulating Materials
基金
广东省“珠江人才计划”引进创新创业团队(2016ZT060412)
广东工业大学百人计划(220418095)。
关键词
热塑性聚酰亚胺
合成方法
性能
研究进展
应用现状
thermoplastic polyimide
synthetic method
performance
research progress
application status
