摘要
引线键合作为一种成熟的互联技术,现阶段仍然是最为广泛使用的一级封装互联工艺,对电路的整体可靠性有着直接的影响,为进一步完善工艺,对金锡熔封工艺过程中烧结炉温在不同温度曲线下对不同引线键合丝的键合强度的影响展开研究,以不同直径的金丝、铝硅丝和粗铝丝为研究样本,在特定的峰值温度和烧结时间下,对比键合强度的前后变化情况;并观察断口形貌,得到金锡熔封工艺对三种键合丝强度衰减的影响,实验数据及结论为确保电子封装工艺中的质量可靠性有参考价值。
Wire bonding is a mature interconnection technology,which is still the most widely used first-level packaging interconnection technology at present,and has a direct impact on the overall reliability of the circuit.In order to further improve the technology,the influence of sintering furnace temperature on the bonding strength of different wire bonding wires under different temperature curves during the Au-Sn sealing process was studied.Gold wire,aluminum silicon wire and coarse aluminum wire with different diameters were taken as research samples,and the changes of bonding strength were compared under specific peak temperature and sintering time.By observing the fracture morphology,the influence of Au-Sn sealing process on the strength attenuation of three kinds of bonding wires is obtained.The experimental data and conclusions have reference value for ensuring the quality and reliability of electronic packaging process.
作者
王明浩
康敏
丁红园
赵鹤然
WANG Minghao;KANG Min;DING Hongyuan;ZHAO Heran(The 47th Institute of China Electronics Technology Group Corporation,Shenyang 110032,China)
出处
《微处理机》
2020年第5期6-9,共4页
Microprocessors
关键词
引线键合
键合强度
金锡
密封
可靠性
Wire bonding
Bond strength
Au-Sn
Sealing
Reliability
