摘要
微波器件中,为了获得更低的寄生效应,会采用引线平直键合和带状引线键合,这些形式的键合引线采用GJB128A-97和GJB548B-2005的键合强度测试方法及其测试值来判断是否合格,易造成误判。对于微波器件的键合强度测试方法进行了分析和试验验证,并给出了合理的试验条件选择以及判据的修正方法,可应用于鉴定检验考核。
In order to obtain lower parasitic effect,flat loop wire and ribbon wire are used in microwave devices.When use the bonding strength test method and its test value in GJB128A-97 and GJB548B-2005 to judge whether these bonging leads are qualified,it is easy to misjudge.In this paper,the bonding strength test method of microwave devices is studied,and test verification has been carried out,the reasonable test conditions and the specific correction method of criterion are given,which can be applied to qualification inspection.
作者
黄东巍
王海丽
吕贤亮
李旭
HUANG Dongwei;WANG Haili;LYU Xianliang;LI Xu(China Electronics Standardization Institute,Beijing 100176,China)
出处
《电子与封装》
2020年第8期21-25,共5页
Electronics & Packaging
基金
装备发展部国家军用标准研究项目:新型军用电子元器件破坏性物理分析方法研究。
关键词
平直引线
带状引线
正向键合
反向键合
flat loop wire
ribbon wire
forward bonding
reverse bonding
