摘要
采用SnSb8Cu5巴氏合金焊丝在Q235钢基体表面进行脉冲MIG堆焊试验,研究了界面层微观组织及元素分布规律,并测试了界面层的结合强度及显微硬度分布。结果表明:在金相显微镜下,界面层巴氏合金组织虽然较表层粗大,但没有出现明显的偏析现象,SnSb硬质相尺寸仅有20μm,进一步通过附带X射线能谱仪的扫描电子显微镜观察发现,巴氏合金堆焊层与钢背结合面犬牙交错,这就增大了结合面积,而且扩散层也达到了10μm厚。通过结合强度剪切试验发现,断裂发生在堆焊层一侧,断口呈撕裂状,抗剪强度达到了77 MPa,显微硬度测试表明,巴氏合金层的硬度较低且分布比较均匀,平均硬度为HV30。
Pulsed MIG arc brazing test was performed on the surface of Q235 steel substrate with Sn Sb8Cu5 Babbitt welding wire.The microstructure of the interface layer and the law of element distribution were studied,and the bonding strength and microhardness distribution of the interface layer were tested.The results showed that under the metallurgical microscope,although the interfacial layer Babbitt alloy was coarser than the surface layer,there was no obvious segregation phenomenon,and the size of the Sn Sb hard phase was only 20μm.Furthermore,through scanning electron microscope observation with an X-ray spectrometer,it was found that the bonding surface of the Babbitt surfacing layer and the steel back was staggered,which increased the bonding area,and the diffusion layer was 10μm thick.According to the combined strength shear test,it was found that the fracture occurred on the side of the surfacing layer,the fracture was tear-like,and the shear strength reached 77 MPa.The microhardness test showed that the hardness of the Babbitt layer was low and the distribution was relatively uniform,with an average hardness of HV30.
作者
吴俊辉
杜学铭
田金华
王梗蕊
刘伟
张华
WU Jun-hui;DU Xue-ming;TIAN Jin-hua;WANG Geng-rui;LIU Wei;ZHANG Hua(School of Materials Science and Engineering,Wuhan University of Technology,Wuhan 430070,Hubei pro.,China;Wuhan Heavy Machine Tool Group Co.,Ltd.,Wuhan 430205,Hubei pro.,China;Essenwell(Wuhan)Industrial Technology Co.,Ltd.,Wuhan 430205,Hubei pro.,China)
出处
《焊接技术》
2020年第6期26-30,I0011,共6页
Welding Technology
关键词
脉冲MIG堆焊
巴氏合金
界面层
显微组织
结合强度
pulsed MIG arc brazing
Babbitt alloy
interface layer
microstructure
bonding strength
