摘要
随着芯片的尺寸减小、集成度和功率密度不断增大,芯片工作时产生的热量越来越多,导致芯片的温度不断攀升,严重影响最终电子元件的使用性能、可靠性和寿命。热界面材料广泛应用于电子元件散热领域,其主要作用为填充于芯片与热沉之间和热沉与散热器之间,以驱逐其中的空气,使芯片产生的热量能更快速地通过热界面材料传递到外部,达到降低工作温度、延长使用寿命的重要作用。本文综述了热界面材料的产业现状和最新研究进展。产业现状部分介绍了热界面材料产量及市场份额、热界面材料主要应用领域需求量、热界面材料在通信等领域的应用和热界面材料市场分析。研究进展部分介绍了近年来研究者在提高热界面材料导热性能方面的研究工作,包括填充型聚合物复合材料的研究进展和本征导热聚合物。
With the continuous increase of chip integration and power density,more and more heat is generated when the chip works.If these heat can not be released in time,the temperature of electronic components will continue to rise,seriously affecting the reliability and service life of electronic components.Thermal interface materials are widely used in the field of heat dissipation of electronic components.They can be filled between electronic components and radiators to expel air,so that the heat generated by electronic components can be transferred to the radiator more quickly,thus reducing the working temperature and prolonging the service life of the radiator.In this review,the industrial status and latest research progress of thermal interface materials are reviewed.In the part of industry status,the output and market share of thermal interface materials,the demand of main application fields of thermal interface materials,the application of thermal interface materials in three major fields,and the market analysis are introduced.In the latest research progress,the recent studies on improving thermal conductivity of thermal interface materials is introduced,including the research progress of filled polymer composites and intrinsic thermal conductive polymers.
作者
杨斌
孙蓉
Yang Bin;Sun Rong(High Technology&Research and Development Center of MOST,Beijing 100044)
出处
《中国基础科学》
2020年第2期56-62,共7页
China Basic Science
关键词
热界面材料
现状
研究进展
thermal Interface Materials
industry status
research progress
