摘要
首先,针对非气密倒装陶瓷球栅阵列封装,设计了典型的结壳热阻测试的器件;其次,基于器件模型,采用有限元建立三维热模型仿真结壳热阻θj-top和θj-bottom值;然后,分析芯片尺寸、导热胶和热沉盖板材料对结壳热阻的影响;最后,针对一款典型的测试器件进行了结壳热阻测试,验证了仿真结果的准确性。
Firstly,a typical junction-to-case thermal resistance test device is designed for nonhermetic flip-chip ceramic ball grid array package.Next,based on the device model,a three-dimensional thermal model is established by using finite element to simulate the junction-to-case thermal resistance,that is,the values of Qj-topand Qj-bottom.Then,the influence of chip size,conductive adhesive and heat sink cover material on junction-to-case thermal resistance is analyzed.Finally,a junction-to-case thermal resistance test is performed for a typical test device,which verifies the accuracy of the simulation results.
作者
王波
杨明
高娜燕
王剑峰
WANG Bo;YANG Ming;GAO Nayan;WANG Jianfeng(No.58 Research Institute of CETC,Wuxi 214035,China)
出处
《电子产品可靠性与环境试验》
2020年第S01期90-93,共4页
Electronic Product Reliability and Environmental Testing
关键词
非气密
倒装
陶瓷
结壳热阻
热特性
仿真
non-hermetic
flip-chip
ceramic
junction-to-case thermal resistance
thermal characteristics
simulation
