摘要
目的:研究半导体激光排龈用于后牙全冠修复的临床效果。方法:选取60例(60颗患牙)行龈下边缘单冠修复的患者,按照随机数表法将其分为观察组和对照组,每组30例。观察组采用半导体激光排龈,对照组采用排龈线法排龈,排龈并全冠修复后对比两种排龈方法后患者的疼痛视觉模拟量表(VAS)评分及排龈效果,并通过对比两组患者排龈后7 d和3个月的牙龈指数(GI)和牙周袋深度(PD),评价牙周健康状况。结果:两组疼痛VAS评分中观察组较对照组疼痛程度更轻,差异有统计学意义(Z=-4.347,P<0.05);两组患牙在牙体预备控制的准确性、模型上基牙边缘完成线以及边缘密合性方面相比,差异无统计学意义,且均达到满意效果,但在排龈后牙龈出血方面观察组优于对照组,差异有统计学意义(x^2=7.177,P<0.05);两组患牙术后7 d及3个月PD值均≤3 mm,无附着丧失。两组治疗后7 d,PD值相较于治疗前均有增长,但观察组PD值较对照组更低,差异有统计学意义(F=16.762,P<0.05)。观察组牙龈的恢复水平更快,而两组GI比较差异则无统计学意义。结论:全冠修复前应用半导体激光排龈较常规排龈线法排龈对组织损伤小、易操作且疼痛程度更轻,患者满意度高,可获得良好的修复效果。
Objective:To investigate the clinical effect of semiconductor laser gingival retraction techniques in the restoration for defect of full crown of posterior tooth.Methods:Sixty patients(60 diseased teeth)who underwent single crown restoration on sub-gingival marginal of gingiva were selected and were divided into observation group and control group according to random number table method,with 30 patients in each group.The patients of observation group were treated with semiconductor laser gingival retraction and those of control group were treated with gingival retraction cord method.The scores of visual analogue scale(VAS)and the effects of gingival retraction between the two gingival retraction methods were compared after gingival retraction and full crown restoration.And the gingival index(GI)and periodontal pocket depth(PD)at 7 days and 3 months after gingival retraction between the two groups were compared to evaluate the periodontal health condition.Results:The scores of VAS of observation group was significantly lower than that of control group(Z=-4.347,P<0.05).There were no significant difference in the accuracy of preparation control of teeth,the finished line at the abutment edge on the model and the edge tightness between the two groups,and both two groups achieved satisfactory results.And the gingival bleeding post gingival retraction of observation group was significantly better than that of control group(x^2=7.177,P<0.05).The PD values both two groups at 1 week and 3 months post operation were≤3 mm,without attachment loss.Compared with that before treatment,PD value both two groups at the 7th d after treatment increased,but PD value of observation group was significantly lower than that of control group(F=16.762,P<0.05).The gingival recovery of observation group was faster than that of control group,while the difference of GI between the two groups was not statistically significant.Conclusion:Before full crown restoration,the semiconductor laser gingival retraction has shown better features in less
作者
申林
褚煜
汪婷婷
张放
谢慧
SHEN Lin;CHU Yu;WANG Ting-ting(Department of Stomatology,Beijing First Hospital of Integrated Traditional Chinese and Western Medicine,Beijing 100026,China)
出处
《中国医学装备》
2020年第6期112-117,共6页
China Medical Equipment
基金
中医基础理论研究所第十三批(2019年度)自主选题“院所协同创新科研专项基金”(YZ-1920)“六神丸局部治疗急性智齿冠周炎的临床研究”。
关键词
口腔
全冠修复
排龈
半导体激光
排龈线
牙龈
Oral cavity
Full crown restoration
Gingival retraction
Semiconductor laser
Retraction cord
Gingiva
