摘要
微电子用玻璃基板加工过程中需要将来料的大板玻璃切割分断成小板,以往采用机械定位的方式,通过定位治具与工件进行机械接触,工件的侧边受到定位治具的压力,易发生形变或者因外力产生崩口或裂痕等缺陷,良品率较低。针对上述问题,设计了基于视觉定位的玻璃基板切割分断生产设备,论述了玻璃基板切割分断机构设计的整体方案、结构组成、视觉定位系统的功能及控制流程。上料搬运、切割和分断过程中分别采用线阵相机识别系统进行初对位和自动对位,减少了单片玻璃的边破和角破,提高了单片玻璃的边缘质量。
In the process of processing the glass substrate used for microelectronics,it is necessary to cut the large plate glass into small plates.The cutting of the glass substrate usually use the means of mechanical positioning.However,when using the means of mechanical positioning,the positioning fixture contacts with the workpiece mechanically,and the side of the workpiece is under the pressure of the positioning fixture,which is prone to deformation or crack or other defects due to external force,so the yield is low.Aimed at above problems,the production equipment of cutting and breaking of glass substrates based on visual positioning was designed,and the overall design scheme,structure composition,function and control flow of visual positioning system of cutting and breaking mechanism of glass substrates were discussed.In the process of loading,cutting and breaking,the linear array camera identification system was used for initial alignment and automatic alignment respectively,which reduces the edge breakage and angle breakage of single piece of glass,and improves the edge quality of the single piece of glass.
作者
周晶
熊长炜
邓杨逍
黄旭东
ZHOU Jing;XIONG Changwei;DENG Yangxiao;HUANG Xudong(Department of Mechatronics Engineering, Dongguan Polytechnic, Dongguan Guangdong 523808, China)
出处
《机床与液压》
北大核心
2020年第9期50-54,共5页
Machine Tool & Hydraulics
基金
广东省教育厅青年创新人才类项目(自然科学)(2017GKQNCX118)
东莞职业技术学院校级基金资助项目(2018c22)。
关键词
视觉定位
玻璃基板
切割
Visual positioning
Glass substrate
Cutting
