摘要
采用直流电沉积法在高锰铝青铜基体上制得Cu-Ni合金镀层,镀液组成和工艺条件为:CuSO4·5H2O 20 g/L,NiSO4·6H2O 84 g/L,C6H5O7Na3·2H2O 75 g/L,十二烷基硫酸钠0.5 g/L,H3BO320 g/L,电流密度15~30 mA/cm^2,pH 7,温度55℃,搅拌速率300 r/min,时间60 min。研究了电流密度对Cu-Ni合金镀层元素成分、微观形貌和耐蚀性的影响。结果表明,在电流密度30 mA/cm^2下所得到的Cu-Ni合金镀层最厚,为25μm,耐蚀性最好,经乙酸盐雾试验168 h后表面仅有几个微小的腐蚀坑。
Cu-Ni alloy coating was prepared on high-manganese aluminum bronze substrate by direct-current electrodeposition from a bath composed of CuSO4·5H2O 20 g/L,NiSO4·6H2O 84 g/L,C6H5O7Na3·2H2O 75 g/L,sodium dodecyl sulfate 0.5 g/L,and H3BO320 g/L at temperature 55℃,pH 7,current density 15-30 mA/cm^2,and stirring rate 300 r/min for 60 min.The effect of current density on the elemental composition,microscopic morphology,and corrosion resistance of Cu-Ni alloy coating was studied.The results showed that the Cu-Ni alloy coating obtained at a current density of 30 mA/cm^2 was the thickest(ca.25μm),and had the best corrosion resistance as shown by the fact that only several micro-pores appeared on its surface after acetic acid salt spray test for 168 h.
作者
房博文
贺春林
霍嘉翔
苏敏
FANG Bowen;HE Chunlin;HUO Jiaxiang;SU Min(Liaoning Province Key Laboratory of Advanced Materials,Shenyang University,Shenyang 110044,China)
出处
《电镀与涂饰》
CAS
CSCD
北大核心
2020年第7期377-382,共6页
Electroplating & Finishing
关键词
铜-镍合金
直流电沉积
电流密度
微观结构
耐蚀性
copper-nickel alloy
direct-current electrodeposition
current density
microstructure
corrosion resistance
