摘要
外形切割是影响LTCC基板质量的一道重要工序。激光切割相对于其他切割方式,具有一定的优势。通过理论分析激光切割参数对LTCC基板质量的影响,对比不同参数的切割效果来对激光参数进行摸索,得到了较好的切割效果。除此之外,还研究了激光切割后基板玻璃熔渣的有效去除,使得激光切割质量有了更大的提升。
Shape cutting is an important process for LTCC substrate.Compare with other cutting methods,laser cutting has some advantages.By theoretically analyzing the effect of laser cutting parameters on the quality of ltcc substrate,comparing the cutting effect of different parameters to explore the laser parameters,a better cutting effect is obtained.In addition,the effective removal of substrate glass slag after laser cutting is also studied,so that the laser cutting quality is improved.
作者
乔璐
李俊
杨兴宇
Qiao Lu;Li Jun;Yang Xingyu(Micro-package Center,The Second Research Institute of China Electronics TechnologyGroup Corporation, Taiyuan Shanxi 030024, China)
出处
《山西电子技术》
2020年第2期87-89,共3页
Shanxi Electronic Technology
