摘要
磁控溅射技术制备有望作为电接触材料的Cu-Ag薄膜的工艺探索。利用方块电阻仪测试薄膜电阻,借助白光干涉仪和扫描电镜分析不同电流和不同偏压下粗糙度、薄膜厚度、Ag含量及微观结构对薄膜电阻影响规律。结果表明:不同银靶溅射电流下,Ag含量及微观结构为影响薄膜面电阻的主要因素,Ag含量低于18.13%(原子比)时膜中Cu-Ag固溶体相占比增大,这可能是引起薄膜面电阻增大的主要原因,柱状晶的贯穿程度越高电阻越小。不同偏压下,薄膜致密性和粗糙度对面电阻的影响较为明显,薄膜致密性越好,缺陷越少,电阻越小,而致密性相差不大时薄膜表面越光滑面电阻越小。
The Cu-Ag alloy coatings,an electrical contact material,were synthesized by magnetron co-sputtering of Cu and Ag targets on substrates of lead-bronze,ceramics and glass.The sheet-resistance was measured with square resistance meter.The effect of the sputtering current of Ag-target and substrate bias voltage on roughness,thickness,Ag-content,microstructure and sheet-resistance was investigated with interferometer,scanning electron microscope and X-ray diffraction.The results show that the sputtering current and bias had a major impact.For example,as the current increased to above 0.5 A,the slowly increased Ag-content increased at a higher rate,accompanied by an increase of the thickness,and the sheet resistance decreased due to formation of the vertically penetrating columnar grains;as the bias increased,the sheet resistance and thickness decreased because the Cu-Ag coating,with decreasing defect-density and surface roughness,became increasingly more smooth and compact.Possible mechanisms were also tentatively discussed.
作者
张丽俊
田武
常勇强
任伟宁
张长军
鲍明东
Zhang Lijun;Tian Wu;Chang Yongqiang;Ren Weining;Zhang Changjun;Bao Mingdong(School of Material Science and Engineering,Chang an University,Xi'an 710061,China;School of Material and Chemistry,Ningbo University of Technology,Ningbo 315211,China;School of Material Science and Engineering,Taiyuan University of Technology,Taiyuan 030024,China)
出处
《真空科学与技术学报》
EI
CAS
CSCD
北大核心
2019年第12期1090-1095,共6页
Chinese Journal of Vacuum Science and Technology
基金
宁波市“科技创新2025”重大专项(2018B10066)
宁波市科技计划项目(2017B10039)
关键词
磁控溅射
Cu/Ag薄膜
溅射电流
偏压
面电阻
Magnetron sputtering
Cu/Ag film
Sputtering current
Bias
Sheet resistance
