摘要
圆片测试中存在大电流的测试项目,比如基准电压的测试,它会受接触电阻的影响,接触电阻太大会抬高测试回路中模拟地的零点,导致测试的基准电压比真实值偏大。类似于以上描述对于在圆片测试过程中受针压大小影响较大的芯片即为针压敏感芯片;此类芯片在测试过程中一般都需要将探针针压加大或者在测试过程中不断地清针和磨针来减小接触电阻,从而减小测试误差。不断地清针和磨针将会给探针造成不可挽回的损耗,缩短探针的使用寿命。为解决以上问题,介绍了一种解决针压影响测试电压的方法。
There are large current test items in the test test of the wafer,such as the test of the reference voltage.It will be affected by the contact resistance.The contact resistance will raise the zero point of the simulated ground in the test loop too much,resulting in the test base voltage being larger than the true value.large.Similar to the above description,the chip that is greatly affected by the size of the needle pressure during the test of the round film is a needle pressure sensitive chip;Such chips generally need to increase the pressure of the probe needle during the test process or continuously clean the needle and grind the needle during the test process to reduce the contact resistance,thereby reducing the test error.However,constantly clearing needles and grinding needles will cause irreparable damage to the probe and shorten the service life of the probe.Therefore,it is very important to find a method to solve the impact of needle pressure on testing voltage.
作者
韩新峰
HAN Xinfeng(China Key System&Integrated Circuit Co.,Ltd.,Wuxi 214072,China)
出处
《电子与封装》
2020年第1期15-18,共4页
Electronics & Packaging
关键词
针压
接触电阻
测试
acupressure
contact resistance
test
