摘要
宇航用系统级封装(System in Package, SiP)产品的可靠性对系统的正常使用起着非常重要的作用,通过对宇航SiP产品的基本结构、失效模式及可靠性预计的关键参数等进行分析,筛选出对宇航SiP产品可靠性有显著影响的因素。针对宇航SiP产品设计流程中的方案设计、原理图设计、版图设计及设计后仿真4个主要阶段,分别提出了设计时应考虑的可靠性因素及设计规则和建议,为宇航SiP产品的可靠性设计及优化提供了依据和参考。
The reliability of aerospace System in Package(SiP) products plays a very important role in the normal use of the system. The basic structure, failure model and the key parameters of reliability prediction are analyzed, and the factors that affect the reliability of aerospace SiP are screened out. Four main stages of the aerospace SiP design process are architecture design, schematic design, layout design and post design simulation, the reliability factors need to be considered, design rules and suggestions are proposed, which provide the basis and reference for the reliability design and optimization of aerospace SiP products.
作者
张小龙
龚科
李文琛
邢建丽
Zhang Xiaolong;Gong Ke;Li Wenchen;Xing Jianli(China Academy of Space Technology(Xi'an),Xi'an 710000,China)
出处
《质量与可靠性》
2019年第6期17-21,共5页
Quality and Reliability
关键词
宇航
系统级封装
设计流程
可靠性设计
aerospace
system in package
design process
reliability design
