摘要
通过分析注塑充填的基础理论,确定了提高产品质量的思路。根据电路板外壳的结构特点及成型要求,设计了注塑成型浇注系统和冷却系统。利用Moldflow模流分析软件和正交试验理论,以体积收缩率、缩痕指数及翘曲变形量为评判指标,优化了熔体温度、充填时间、保压时间、冷却时间、开模时间、注射压力和保压压力7个工艺参数,得到了最佳的注塑成型工艺参数。设计并制造出电路板外壳的成型零件,并对滑块的制造工艺进行了详细的分析,通过生产试制出了合格的塑件,验证了正交试验方案的科学性,模拟结果可以用于实际生产中。
The basic theory of the injection filling was analyzed to determine the way of thinking of improving product quality.According to the structural characteristics and molding requirements of the circuit board shell,the injection molding gating system and cooling system were designed.Using the moldflow analysis software and the theory of orthogonal experiment,based on volume shrinkage ratio and surface sink index and warp value as index,the seven parameters of melt temperature,injection time,holding time,cooling time,opening time,injection and holding time were optimized,so the optimum injection molding process parameters were obtained.The molding parts of circuit board shell were designed and manufactured,and to slide block the manufacture craft to carry on the multi-analysis,the qualified plastic part was produced by trial production,verified the scientificalness of orthogonal test scheme,the results can be used for the actual production.
作者
赵建平
李盛辉
王力
ZHAO Jianping;LI Shenghui;WANG Li(Zijin College,Nanjing University of Science & Technology, Nanjing 210023,CHN)
出处
《制造技术与机床》
北大核心
2019年第6期170-175,共6页
Manufacturing Technology & Machine Tool
基金
教育部产学合作协同育人项目(201601004007)
南京理工大学紫金学院科技课题项目(2018ZRKX0401009)
