摘要
为满足可靠性试验需求,利用微波设计软件Advanced Design System、三维电磁场分析软件HFSS、三维绘图软件SolidWorks,设计了一种用于X波段射频芯片可靠性试验的夹具。设计过程包括壳体仿真、微带仿真、绝缘子选型、连接器选型,经过实际工艺验证,一致性较好,可批量生产。
Meet the needs of reliability test,with microwave circuit design simulation software Advanced Design System and three-dimensional electromagnetic field analysis software HFSS,three-dimensional drawsoftware SolidWorks,design a x wave fixture For RF MMIC reliability test.The design process contains cavity simulation, micro-strip simulation,insulator lectotype,connector lectotype,via actual craft testing,have good coherence,can volume production.
作者
郑赞赞
Zheng Zan-zan(Zhejiang Chengchang Technology Co.Ltd,Zhejiang Hangzhou 31000)
出处
《电子质量》
2019年第5期22-25,共4页
Electronics Quality
关键词
射频芯片
壳体仿真
微带仿真
可靠性试验
RF MMIC
cavity simulation
micro-strip simulation
reliability test
