摘要
为深入理解单晶锗纳米切削特性,提高纳米锗器件光学表面质量,首次采用三维分子动力学(MD)的方法研究了单晶锗纳米切削过程中工件原子的温度分布情况,研究了晶体的各向异性(100),(110),(111)晶面对切削温度的影响及切削温度对切削力的影响。结果表明,在切削过程中最高切削温度分布在切屑当中,达到了460 K。刀具的后刀面与已加工表面之间的区域也有较高的温度,在400 K以上。在3个不同的晶面中,(111)晶面的切削温度最高,(111)晶面的原子密度最大,即为单晶锗的密排面,释放出的能量最多。切削温度对切削力也有影响,切削温度越高,工件中原子受到的切削力越小。
In order to understand the nano-cutting properties of single crystal germanium and improve the optical surface quality of nano-germanium devices, the three-dimensional molecular dynamics(MD) method was firstly applied to investigate the temperature distribution of the material atoms during the nano-cutting process of single crystal germanium. The anisotropy effect of Ge(100),(110) and(111) on the cutting temperature and the influence of cutting temperature on cutting force were investigated. The results show that the highest cutting temperature during the cutting process is distributed among the chips, reaching 460 K. There is also a high temperature region in the friction zone of the tool back face, and the highest temperature is above 400 K. Among the three different crystal planes, the highest cutting temperature exists on the surface of Ge(111) crystal. Atomic arrangement is the most intensive in Ge(111), namely, Ge(111) is the densely packed surface of the single crystal germanium, which releases the most energy. What’s more, cutting temperature has also made an impact on the cutting force. As the cutting temperature increases, the cutting force of the material atoms is reduced.
作者
罗良
杨晓京
刘宁
耿瑞文
Luo Liang;Yang Xiaojing;Liu Ning;Geng Ruiwen(Kunming University of Science and Technology,Kunming 650500,China)
出处
《稀有金属材料与工程》
SCIE
EI
CAS
CSCD
北大核心
2019年第4期1130-1134,共5页
Rare Metal Materials and Engineering
基金
National Natural Science Foundation of China(51765027,51365021)
关键词
单晶锗
各向异性
分子动力学
切削温度
切削力
single crystal germanium
anisotropy
molecular dynamics
cutting temperature
cutting force
