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电容式MEMS差压压力传感器的设计与制造 被引量:3

Design and Fabrication of Capacitive MEMS Differential Pressure Sensor
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摘要 基于硅-玻璃结构,设计并制造了一种MEMS电容式差压压力传感器,利用由硅MEMS微纳米加工技术制作的硅可动薄膜作为压力的感测电极,利用在Pyrex玻璃上淀积Au薄膜作为固定电极,通过硅-玻璃阳极键合工艺实现硅结构与玻璃的键合。在键合过程中实现Pryex玻璃上的pad与硅可动电极的互联,实现MEMS电容式差压压力传感器功能。所设计的MEMS差压压力传感器的量程范围为0~40kPa,其电容变化范围为5.4~7.3pF,电容变化量率达到了35%。利用二次曲线拟合,满量程误差小于0.4%FS,可满足大部分应用场合的需求。 A MEMS capacitive differential pressure sensor with a silicon-glass structure is designed and manufactured.A silicon movable film made by silicon MEMS micro/nano processing technology is used as a pressure sensing electrode,an Au film deposited on Pyrex glass as a fixed electrode,and silicon structure and glass are bonded through a silicon -glass anodic bonding process.During the bonding process,the pad on the Pryex glass and the silicon movable electrode are interconnected to realize the function of MEMS capacitive differential pressure sensor.The range of the designed MEMS differential pressure sensor is 0~40kPa,its capacitance variation range is 5.4~7.3pF,and the capacitance variation rate reaches 35%.Using quadratic curve fitting,the full-scale error is less than 0.4%FS,which can meet the needs of most applications.
作者 侯智昊 赵雪莹 王增智 HOU Zhihao;ZHAO Xueying;WANG Zengzhi(College of Electronics and Information Engineering,Shenyang Aerospace University,Shenyang 110136,China;The 47th Institute of China Electronics Technology Group Corporation,Shenyang 110032,China)
出处 《微处理机》 2019年第2期7-9,共3页 Microprocessors
基金 辽宁省自然科学基金指导计划"面向通用航空应用的MEMS电容式大气压力传感器研究"(201602555)
关键词 微电子机械 压力传感器 电容式传感器 MEMS Pressure sensor Capacitive sensor
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