摘要
以丙烯酸树脂和环氧树脂的混合物为基体,以银粉为填料,制备活化银胶。将银胶涂覆于聚对苯二甲酸乙二酯(PET)基材上,形成导电涂层,考察了涂层的可催化化学镀铜特性以及涂层与基材的结合力;同时考察了丙烯酸树脂与环氧树脂的质量比对活化胶的交联度、剥离强度、胶层可镀性的影响,基体的镀液渗透性与胶层可镀性的关系,以及活化胶中银粉含量和分散性、胶层干燥固化过程中的分散稳定性对活化胶性能的影响。结果表明:当活化胶交联度为59.8%、银粉与树脂的质量比为2∶1时,胶层具有良好的镀液渗透性,此时胶层可镀性好,并具有较高的剥离强度。
The subtraction process is prevailing in manufacturing printed circuit board although it causes problems such as high cost,serious environment pollution and long production cycle.These problems could be solved through the usage of the addition process.Through screen printing or inkjet printing,the prevalent addition process prints the conductive paste or ink directly on the insulating media to form the circuit.However,this process is limited by the shortage of the conductivity of the circuit,which could be improved significantly by applying electroless plating on the printed circuit.Unfortunately,it is impossible to apply electorless plate on the circuit pattern using current conductive paste or ink.A new addition process for manufacturing printed circuits was focused on.A novel ink was prepared by dispersing silver powders into the solution of acrylic resin with epoxy resin in ethanol,and then coated on the PET substrate to form an activating layer after thermal curing.This paper investigated the electroless copper plating on the activating layer and its binding force with substrate,the ratio of two kinds of resins and its effect on the crosslinking degree,bond strength and plating ability of the activating coating,relationships between the permeability and the plating ability of the coating in plating baths,and how the properties of the coating were affected by the amount,dispersion and dispersion stability of the silver powder during drying and curing.The results showed that the plating ability(on PET substrate)and the peeling strength of the activating adhesive increased by adjusting the curing crosslinking degree and the amount of the silver powder in the coating layer,respectively.When the crosslinking degree of the coating was 59.8%and the mass ratio of silver powder to resin was 2∶1,a uniform and continuous plating layer could be obtained.The peeling strength of the layer reached 16 N/cm,a value exceeded the current industrial level.It was found that the plating ability was determined by the plating bat
作者
聂旭坤
方斌
袁双龙
梁莹
NIE Xu-kun;FANG Bin;YUAN Shuang-long;LIANG Ying(Institute of Nuclear Technology and Application,School of Science, East China University of Science and Technology,Shanghai 200237,China)
出处
《功能高分子学报》
CAS
CSCD
北大核心
2018年第6期609-614,共6页
Journal of Functional Polymers
关键词
印制电路板
加成法
活化胶
printed circuit board
addition process
activating adhesive
