摘要
为了使聚酰亚胺(PI)薄膜表面具有良好的活性,采用NaOH溶液对PI薄膜进行化学改性,在PI薄膜表面制备金属Ag微粒,然后进行化学镀铜。采用傅里叶变换衰减全反射红外光谱仪(ATR-FT-IR)、X线衍射仪(XRD)、扫描电子显微镜(SEM)和电阻测试仪等对复合薄膜的结构和性能进行表征,并讨论AgNO_3溶液处理时间对Cu层的影响。结果表明:PI薄膜表面在NaOH溶液中发生水解,在AgNO3溶液中实现Na^+和Ag^+间的离子交换,经过NaBH_4还原,在PI薄膜表面形成Ag微粒,该Ag微粒可以引导化学镀铜反应的发生。试验中,控制其他条件不变,在2g/L的AgNO_3溶液中离子交换30min可以制得形貌和电性能良好的PI/Cu复合薄膜,方块电阻可低至0.585Ω。
The polyimide（ PI） film was modified with Na OH solution to obtain the metal silver particles on the surface for chemical copper plating with the improved activity of PI film surface. The structures and properties of composite film,as well as the effects of AgNO_3 solution on the copper layer were characterized by Fourier transform attenuated total reflection infrared spectrum（ ATR-FT-IR）,X-ray diffractometer（ XRD）,scanning electron microscope（ SEM）,and four-point probe meter. Results showed that the surface of PI film was hydrolyzed in Na OH solution with the ion exchange between Na＋and Ag＋happened in AgNO_3 solution,and the Ag particles were formed on the surface after reduced by Na BH4,inducing the reaction of copper plating. The resistance of PI / Cu composite film with fine morphology and electrical property could be as low as 0. 585 Ω under the condition of the ion exchange for 30 min in 2g / L AgNO_3 solution with invariant other conditions.
出处
《南京工业大学学报（自然科学版）》
CAS
北大核心
2016年第2期114-118,共5页
Journal of Nanjing Tech University(Natural Science Edition)
关键词
聚酰亚胺
银
铜
化学镀铜
polyimide
silver
copper
electroless copper planting
