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掺磷氢化硅低温微晶化的研究

Study on Low Temperature n-Type Hydrogenated Microcrystalline Silicon
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摘要 我们用辉光放电法在较低的衬底温度下(90℃)获得了掺磷微晶化硅(n^+μC-Si).并对微晶化与工艺条件之间的关系进行了详细的研究,在150℃衬底温度,2%掺杂时获得了电导率近30(Qcm)^(-1),电导激活能近似为零的微晶化材料.对微昌化材料的结构进行了小角度X光衍射,拉曼散射谱的分析,并用扫描电镜观察了形貌.这种材料的晶粒较小而且结构均匀.又由于生长温度低,rf功率小,有利于与其它器件工艺匹配.文章对实验结果进行了讨论. Crystallization of phosphorous-doped hydrogenated silicon was initiated at asubstrate tem-perature below 90℃ and low RF power.The relationship between microcrystallization andthe deposition condition has been studied in detail.The μc-Si:H material with conductivity of30(Ωcn)^(-1) and conductivity activation energy 2meV was obtained at substrate temperature of150℃.Through the analysis of small angle X-ray diffraction, Raman scattering and SEM,we found the microcrystalline size is small and the morphologies are uniform.With the abovefeature, this kind of p-doped μc-Si:H material has great advantage in matching with othertechnology of devices.Finally,the experiment results are discussed.
出处 《Journal of Semiconductors》 EI CAS CSCD 北大核心 1991年第9期555-560,T001,共7页 半导体学报(英文版)
基金 国家自然科学基金
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